Electrosoft is a proud sponsor of the Transglobal Secure Collaboration Symposium, an industry-leading conference and vendor exhibition focused on secure collaboration among industry partners and their supply chain members, mitigating the risks of information security breaches and accelerating secure information sharing while reducing overall program costs.

This premiere event will be held November 14-15, 2013 at the Hyatt Regency Crystal City in Arlington, VA. Speakers include information security leaders from government agencies, military departments, technology companies and the intelligence community, as well as TSCP members from aerospace and defense. The conference will showcase the work of the TSCP community and its efforts to solve common challenges that impact major programs today, including topics such as: Federal Identity, Credential and Access Management (FICAM); Federal Cloud Credential Exchange (FCCX); National Strategy for Trusted Identities (NSTIC); Mobility and Digital Strategy; Identity in the Cloud; Device Health/Machine Identity; PIV and PIV-I High Assurance Cards; Identity Trust Framework; Supply Chain Authentication, and more.

Electrosoft’s own Steve Skordinski will be participating in two technical sessions of the symposium: “Legal and Policy Considerations in Trust Frameworks” and “Technical Infrastructure and Demos of Trust Frameworks in Practice”. Steve will speak about how a Trust Framework Provider (TFP) facilitates transactional trust within a federated community, and participate in an Attribute Based Access Control (ABAC) demonstration that involves an Attribute Exchange.

Electrosoft will host a booth at the Secure Collaboration Showcase Exhibition to highlight our unique blend of services and solutions to promote the adoption of secure online collaboration mechanisms between government and industry. Please visit us at Booth A to learn more.

For more information about the Transglobal Secure Collaboration Symposium, visit www.tscp.org.